One-Stop IDM Chip Supplier
Covering the full process chain — chip design, MOCVD epitaxy, photolithography, cleaving & coating,
packaging, testing, and high-volume production.
Wafer
2/3inches optional
InP/GaN/GaAs Materials Optional
Laser Type:DFB,VCSEL,FP,SLD,DBR
Bare Chip
Different Cavity Length
High Speed Modulated
Narrow Linewidth
Chip On Carrier
TE polarization
Carrier Size Optional
Reliable and Low cost
Laser Diode
Diversified packaging.
Different power options
Full Performances tested
Laser System
Expand customer-defined functions
Customize According to Request
LD-PD makes chips closer to applications
We know how to change this.