Part No. | Quantity | Price | Subtotal | ETD |
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850 nm single-mode VCSELs are the perfect choice for demanding sensor applications due to their improved optical characteristics. Higher-order longitudinal and transversal modes are suppressed by the innovative chip design; at the same time, the polarization is linearly stable.
Picture | Name | Part NO. | Description | Central wavelength | Output power | Package | Lead Time | Price | Operation |
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● Low dependence of electrical and optical characteristics over temperature
● Data rates from OC-3 to OC-48
● Vertical Cavity Surface-Emitting Laser
● Internal TEC and Thermistor, ESD protection
● Narrow linewidth
● 2 nm tunability with TEC
Condition:TO P = 20°C, IO P = 10.0 mA unless otherwise stated (TO P = chip backside temperature, controlled by the TEC)
Parameters | Symbol | Min | Typ | Max | Unit | Remark |
Emission Wavelength | λR | 850nm | ||||
Threshold current | ITH | 1 | mA | |||
Output Power | Popt | 0.5 | 1 | mW | ||
Threshold Voltage | UTH | 1.8 | V | |||
Driving Current | IOP | 3 | mA | Popt = 0.5mW | ||
Laser voltage | UOP | 3 | V | Popt = 0.5 mW | ||
Electro optic conversion rate | ηWP | 12 | % | Popt = 0.5 mW | ||
Slope efficiency | ηS | 0.3 | W/A | |||
Rise and Fall time | Tr /Tf | 90/120 | Psec | |||
Differential series resistance | RS | 100 | 200 | Ω | Popt = 0.5 mW | |
3dB bandwidth | ν3dB | 0.10 | 2.5 | GHz | Popt = 0.5 mW Due to ESD protection diode | |
Relative intensity noise | RIN | -130 | -120 | dB/Hz | Popt = 0.3 mW @ 1 GHz | |
Wavelength tuning over current | 0.6 | nm/mA | ||||
Wavelength tuning over temperature | 0.06 | nm/K | ||||
Thermal resistance (VCSEL chip) | Rthermal | 3 | 5 | K/mW | ||
Side mode supression | 35 | dB | I = 2 mA | |||
Beam divergence | θ | 10 | 25 | ° | Popt = 0.5mW, full width 1/e2 | |
Spectral Width | 100 | MHz | Popt = 0.5 mW |
Tec Characteristics | Unit | Min | Typ | Max | Remark |
Tec Current | mA | -150(Heating) | +300(Cooling) | Proper Heart Sink Required | |
NTC Thermistor Resistance | KΩ | 9.5 | 10.0 | 10.5 | T=25℃@10 KΩ |
NTC Thermistor Resistance | KΩ | 10/exp{3892-(1/289K-I/TOP)} |
Spectrum
L-I Curve(T@25°C)
Temperature / wavelength tuning over TEC current*
Beam Quality Profiler (2D/3D)
2D
3D
Beam profile
In the far field, the intensity distribution of the single-mode VCSEL is perfectly Gaussian shaped
TO package Bottom side View
Pin | Definitions | Pin | Definitions |
1 | TEC ( - ) | 5 | TEC ( + ) |
2 | THERMISTOR ( + ) | 6 | THERMISTOR |
3 | NA | 7 | NA |
4 | VCSEL Cathode | 8 | VCSEL anode |
Absolute Maximum Ratings
Item | Unit | Min | Typ | Max |
Store Temperature | ℃ | -40 | 25 | 125 |
Chip Temperature | ℃ | +10 | 25 | 40 |
Operating Current | mA | 0 | 3.0 | 5.0 |
Forward Voltage | V | 0.8 | 3.0 | 4.8 |
TEC Current | mA | -150 | - | +300 |
Soldering Temperature* | ℃ | 100 | 130 | 260 |
Electrical Power Dissipation | mw | - | - | 5 |
(*TEC temperature must be below 150°C)
● Access network for long distance
● Local area network
● Gigabit Ethernet
PL-VCSEL-□□□□-☆-A8▽-XX
□□□□:Wavelength
0760:760nm
0850-850nm
*****
1550:1550nm
☆ :TEC
0:Without TEC
1:With TEC
▽:Wavelength Tolerance
1:±0.5nm
2:±1.5nm
XX: Fiber and Connector Type
FS=Free Space
BFSA=Butterfly Package with HI780+ FC/APC
CPSA=Coaxial Package with HI780+ FC/APC
BFSP=Butterfly Package with HI780+ FC/PC
CPSP=Coaxial Package with HI780+ FC/PC
BFPP=PM Fiber+ FC/PC
PA=PM Fiber+ FC/APC