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Home / Photodiode / InGaAs Photodiode / PD1000 InGaAs Photodiode Chip

PD1000 InGaAs Photodiode Chip

LD-PD's  InGaAs pin structure based on InP by MOCVD method and planar diffusing technology. The sensitive areas of TO photodiode series products are φ75µm、φ300µm、φ500µm、φ1mm、φ2mm、φ3mmrespectively. The products with other sensitive area, shape or package style can also be provided according to the demand of users.

Name Price Operation
PD1000 InGaAs Photodiode Chip
[Explore More]
$15.00
 
Features

● High Responsivity, front side illuminated,double-side pads

● Φ=1mm, round optical window 

● Optimized for Machane(CH4) detection(1654nm), improving responsivity in low-temperature environment

E/O Characteristics

The Opto-electronic Characteristics(@Tc=22±3℃)

Parameters

Sym.

Test conditions

Min

Typ

Max

Unit

Response Spectrum

λ

-

10001680

nm

Active Diameter

Φ

-

1000

μm

Reponsivity

 Re

 λ=1.31μm, VR=5V, φe=100μw

 0.95

-

 -

A/W

ForwardVoltage

 VF

 IF=1mA

 -

 -

0.6

V

Reverse Breakdown Voltage

VBR

ID=10 A, φe=0

35

-

-

V

Dark Current

ID

VR=5V,   φe=0

-

-

2.5

nA

Capacitance

CPD

VR=5V, φe=0, f=1MHz

-

-

70

pF

Rising Time

tr

VR=5V,   RL=50Ω

-

-

7

ns

Outline Diagram and Die Dimensions

1000.1.png

Die Size

1290μm×1290μm

Die Thickess

175±10μm

P Bond Pad Diameter

100μm

Photosensitive Diameter

1000μm

Extend Electrode Length

50μm

P metal

Au

N metal

Au

Note: The structure of PIN PD is planar and front illuminated with P electrode on the top and N electrode on the bottom.


Absolute Maximum Rating

Parameter

Symbol

Rating

Unit

Operating temperature

TC

-40+85

Storage temperature

TSTG

-50+125

Forward Current

IF

10

mA

Reverse Current

IR

10

mA

ESD susceptibility

≥300

V

Application Notes

a. Take appropriate ESD protections to avoid damage.

b. InP chips are fragile and easily damaged, so special caution should be used when handling. 

c. Do not handle with tweezers. A vacuum tip with a flat surface is recommended. Bonding force and temperature should be applied in a gradual fashion.

Application

● Fiber communication

● Fiber sensor