Part No. | Quantity | Price | Subtotal | ETD |
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LD-PD's InGaAs pin structure based on InP by MOCVD method and planar diffusing technology. The sensitive areas of TO photodiode series products are φ75µm、φ300µm、φ500µm、φ1mm、φ2mm、φ3mmrespectively. The products with other sensitive area, shape or package style can also be provided according to the demand of users.
Picture | Name | Part NO. | Description | Response wavelngth | Material | Active area | Lead Time | Price | Operation |
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● High Responsivity, front side illuminated,double-side pads
● Φ=1mm, round optical window
● Optimized for Machane(CH4) detection(1654nm), improving responsivity in low-temperature environment
The Opto-electronic Characteristics(@Tc=22±3℃)
Parameters | Sym. | Test conditions | Min | Typ | Max | Unit |
Response Spectrum | λ | - | 1000~1680 | nm | ||
Active Diameter | Φ | - | 1000 | μm | ||
Reponsivity | Re | λ=1.31μm, VR=5V, φe=100μw | 0.95 | - | - | A/W |
ForwardVoltage |
VF |
IF=1mA |
- |
- |
0.6 |
V |
Reverse Breakdown Voltage | VBR | ID=10 A, φe=0 | 35 | - | - | V |
Dark Current | ID | VR=5V, φe=0 | - | - | 2.5 | nA |
Capacitance | CPD | VR=5V, φe=0, f=1MHz | - | - | 70 | pF |
Rising Time | tr | VR=5V, RL=50Ω | - | - | 7 | ns |
Die Size | 1290μm×1290μm |
Die Thickess | 175±10μm |
P Bond Pad Diameter | 100μm |
Photosensitive Diameter | 1000μm |
Extend Electrode Length | 50μm |
P metal | Au |
N metal | Au |
Note: The structure of PIN PD is planar and front illuminated with P electrode on the top and N electrode on the bottom.
Absolute Maximum Rating
Parameter | Symbol | Rating | Unit |
Operating temperature | TC | -40~+85 | ℃ |
Storage temperature | TSTG | -50~+125 | ℃ |
Forward Current | IF | 10 | mA |
Reverse Current | IR | 10 | mA |
ESD susceptibility | ≥300 | V |
Application Notes:
a. Take appropriate ESD protections to avoid damage.
b. InP chips are fragile and easily damaged, so special caution should be used when handling.
c. Do not handle with tweezers. A vacuum tip with a flat surface is recommended. Bonding force and temperature should be applied in a gradual fashion.
● Fiber communication
● Fiber sensor