The device is a compound Si-PIN structure. To reach high response, back side hole etching process is used for thinner I layer, when carrier go through the floating area, optical current will appear .Slow optical carrieIP are shorted for fast response purpose.We has our Patented package Desgin-“Bullet” design adopts Two optimized chips special for different wavelength. One we called Circle Chip and the other is square Chip.
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